technical data sheet 1 / 5 smt plug receptacle r223.434.000 - series : mmbx issue : 0808 b in the effort to improve our products, we reserve t he right to make changes judged to be necessary. all dimensions are in mm. . . pn ao components body center contact outer contact insulator gasket others parts - - materials bronze,brass beryllium copper; brass - ptfe - - plating ( m m ) npgr npgr - -
technical data sheet 2 / 5 smt plug receptacle r223.434.000 - series : mmbx issue : 0808 b in the effort to improve our products, we reserve t he right to make changes judged to be necessary. packaging specification standard unit other 100 w option contact us electrical characteristics environmental impedance 50 w operating temperature - 55/+155 c frequency 0 - 12.4 ghz hermetic seal na atm.cm3/s vswr 1.065 + 0,0000 x f(ghz) maxi panel leakage na insertion loss 0.12 ? f(ghz) db maxi rf leakage - ( 100 - f(ghz)) db maxi voltage rating 330 veff maxi dielectric withstanding voltage 1000 veff mini insulation resistance 1000 m w mini other characteristics assembly instruction others : to 2ghz (1.106 --- 2 to 6ghz) mechanical characteristics interface mmbx only ,up to 2.5ghz pcb to pcb -45 db up to 2.5 ghz center contact retention ax ial force C mating end 10 n mini axial force C opposite end 10 n mini torque na n.cm mini recommended torque mating na n.cm panel nut na n.cm mating life 100 cycles mini weight 0,4200 g
technical data sheet 3 / 5 smt plug receptacle r223.434.000 - series : mmbx issue : 0808 b in the effort to improve our products, we reserve t he right to make changes judged to be necessary. 1. deposit solder paste snag4cu0.5 on mounting zone by screen printing application. we recommend a low residue flux. we advise a thickness of 150 micromm ( 5.850 microi nch ). verify that the edges of the zone are clean. 2. placement of the receptacle on the mounting zone wi th an automatic machine of pick and place type. a video camera is recommended for positioning of th e component. adhesive agents must not be used on the receptacle. 3. this process of soldering has been tested with conv ection oven. below please find, the typical profile to use. 4. the cleaning of printed circuit boards is not oblig ed. 5. verification of solder joints and position of the c omponent by visual inspection. temperature profile parameter value unit temperature rising area 1 - 4 c/sec max peak temperature 260 c max dwell time @260c 10 sec min dwell time @235c 20 sec max dwell time @235c 60 sec temperature drop in cooling area -1 to - 4 c/sec max dwell time above 100c 420 sec
technical data sheet 4 / 5 smt plug receptacle r223.434.000 - series : mmbx issue : 0808 b in the effort to improve our products, we reserve t he right to make changes judged to be necessary. pcb application 75 application 50 with b = 0,55mm with b = 1,2mm pcb thickness (mm) coplanar ligne a (mm) pcb thickness (mm) coplanar ligne a (mm) 0,8 0,350 0,8 0,190 1,0 0,360 1,0 0,200 1,2 0,365 1,2 0,205 1,6 0,375 1,6 0,210 coplanar line pattern and signal are on the same side the material of pcb is epoxy resin (fr4). (er = 4.6) the solder resist should be printed except for the land pattern on the pcb pattern
technical data sheet 5 / 5 smt plug receptacle r223.434.000 - series : mmbx issue : 0808 b in the effort to improve our products, we reserve t he right to make changes judged to be necessary. nom
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